Soic package. 7 mm PDIP Pin count: 8 -24 pins .

Soic package Different manufacturers use different designations: Analog Devices uses the term micro SOIC, Maxim uses SO/uMAX, and National Semiconductor uses MiniSO. stp)： 3D model Data in STEP Format; Land Pattern(. Many are 1. The most common SOT are SOT23 variations,. SOIC 패키지의 장점 Dec 30, 2024 · SOP（Small Outline Package）封裝和SOIC（Small Outline Integrated Circuit）封裝之間的差異相對細微，實際上，SOIC 是 SOP 的一種具體類型。 以下是它們的細微差別及是否可以混用的分析： 1. Dimension "D" does not include mold flash, protrusions or gate burrs. The most common IC package types include-DIP IC Package; 2. The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. Jun 6, 2023 · SOIC封装和SOP（Small Outline Package）封装是两种常见的表面贴装技术（SMT）封装，它们之间的区别如下： 引脚排列方式：SOIC封装的引脚是两排排列，而SOP封装的引脚是一排排列。SOIC封装的引脚通常位于封装的两侧，而SOP封装的引脚则在封装的一侧。 Size comparison of transistor packages. Join the GrabCAD Community today to gain access and download! Jul 25, 2024 · For low power applications of that particular package. 65 mm to 1. SOP 封装 和 SOIC 封装的差异－可以混用吗?? 关键字 :SOP 封装 SOIC. 6. The small outline integrated circuit has package information stated with the prefix SO. SOIC has been widely used since the late ’70s. 3D model(. Dimension "E1" does not include inter-lead flash or protrusion. The SOIC is a plastic package, available in 6, 8, 10, 14, and 16 pin versions with a body width of 4 mm, and in 16, 20, 24 and 28 pin versions with a wider body of 7. See full list on electronicsforu. It is one of the most commonly used surface mount packages. These variants feature different physical dimensions while maintaining a consistent pin pitch of 1. 0mm to 2. Package height: Ranges from 1. It typically has 8 leads. The specs seem identical but the price is different (not by much, but different). 65” SOP – Exposed pad on underside; often used for power devices; SOIC packages range from 1. The leads protrude from the longer edge of the package. Never trust the manufacturer's package name. Apple will use 2. Oct 27, 2017 · Part Selection: SOIC-8 Package: NE555 555 timer ICs SOIC-16 Package: MAX232 RS-232 driver/receiver ICs. Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. This means it can be easily installed in tight spaces, allowing for greater flexibility with design. 65mm which is almost half of the SOIC package. SOIC packages have wider and longer dimensions to accommodate the higher pin count, while SOP packages are more compact and have a smaller footprint. This industry-standard package runs in very-high volume and provides value-added, low-cost solutions for a wide range of applications. Meet all present and future national and international statutory requirements. Regularly and continuously improve the performance of our products, processes, distribution and Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order a 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. WSON is Plastic Small-Outline No-Lead (SON) Package defined by JEDEC. a SOIC-xN (SOIC narrow)) family of packages is governed by the JEDEC MS-012-AA standard. SOIC Package. 10 sprocket hole pitch cumulative tolerance ± 0. Solo el primero contiene silicio fermiónico (fosilizado) y semiconductores fermiónicos (dieléctrico de neutrones, un semiconductor que consiste en metales aislados y átomos de carbono The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. 1. III. Software Migration Guidelines 1. They are generally available in the same pin-outs as their counterpart DIP ICs. 1. 2. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Mar 29, 2023 · The lead position of SOIC packages also allows for better electrical performance, as the leads have shorter paths to the IC. Aug 12, 2020 · 在事实上 ，针对soic封装的尺寸标准 ，不同的厂家分别或同时遵循了两种不同的标准jedec（美国联合电子设备工程委员会）和eiaj（日本电子机械工业协会） ，结果就导致了“宽体 、中体和窄体”三个分支概念的出现 ，把很多人搞得晕头转向 ，也激起很多砖家在 Jun 30, 2021 · SOP/SOIC/SO (Small Outline Package) A surface mounts integrated circuit package is known as SOIC. SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. Semiconductor & Storage Products Home Debido a que SOIC es fermiónico (silicio comercial, mezclado con semiconductores), existen dos tipos de chips SOIC: SOIC comercial y SOIC híbrido. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. Migration Considerations 1. 300 Inch) 05-08-1620 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 10:09:03 AM Fig 1: A Small Outline IC (SOIC) package mounted with SMD technology. 27mm lead pitch. Sep 26, 2023 · The SOIC-8 package also has a very low profile compared to other packages. But just to be clear for the OP, these are just TI’s codes, not any kind of industry standard. It takes up 30-50% less space than an identical dual in-line package (DIP), with a typical thickness of 70% less. In terms of cost, DIP packages are generally less expensive than SOIC packages. The ISO772x devices are high-performance, dual-channel digital isolators with 5000 VRMS (DW and DWV packages) and 3000 VRMS (D package) isolation ratings per UL 1577. 封装定义: Jul 21, 2017 · For example, look at the specified package height from the bottom of the pins to the top of the body. They can have a few different variants: SSOP Packages: SSOPs, or shrink small outline packages, have a pin pitch of 0. SOP packages typically have a smaller lead spacing devices. Because of surface-mount, easy assembly with better electrical Nov 19, 2024 · What is a Small Outline Integrated Circuit (SOIC)? A Small Outline Integrated Circuit (SOIC) is a surface-mount IC package that offers a compact size and good electrical performance. 65mm or 0. SOICs are widely used in various electronic applications, such as consumer electronics, automotive systems, and industrial equipment. Feb 21, 2021 · Also, note that you mixed up the part suffixes and the package drawing codes. SOP Packages. 7 mm PDIP Pin count: 8 -24 pins SOIC VSSOP WQFN SOP TVSSOP WCSP SSOP SOT X2SON QSOP PiccoStar WSON TSSOP TSMC-SoIC ® services include the custom manufacturing of semiconductors, memory chips, wafers, integrated circuits, product research, custom design and testing for new product development, along with technology consultation services for electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafers, and integrated circuits. 4. 5 cm in 1 m actually 3. Oct 23, 2024 · Body widths of typical SOIC packages can vary between 3. The micro SOIC package is another style of SOIC package, designed only for 8-pin or 10-pin ICs. SOIC packages typically have gull-wing leads on two sides of the package, providing easy soldering and reliable electrical connections. SoIC는 'System On Intergrated Chips'의 첫글자들을 딴 TSMC의 브랜드입니다. It has a exposed thermal pad on the underside. Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order なお、SOICは『Small Outline Integrated Circuit』の頭文字をとったものであり、『SOL(Small Outline L-leaded package)』や『SO』と表記されることもあります。 なお、ガルウィング形(L字形)のリードがパッケージの 4側面 から出ているものは、 QFP(Quad Flat Package) と呼ばれてい SOIC belongs to the SOP package family. The SO package was developed in Europe in the mid-1970s particularly for the emerging electronic watch market. Compare the dimensions and characteristics of different SOIC variants and related packages. Advantages of Ceramic SOIC: Multilayer Package ; Solder, Glass or Epoxy Seal Small-outline IC (SOIC) Small-outline (SOIC) packages are another common type of IC package that is widely used in electronic devices. SOIC, whose full name is Small Outline Integrated Circuit, is a type of chip package designed to replace the traditional DIP (Dual In-line Package). Material: black conductive or black static dissipative 4. ISOW1432DFMEVM is an evaluaiton module (EVM) used to evaluate the high performance, reinforced isolated RS-485/RS-422 transceiver with integrated DC-DC converter ISOW1432 in a 20-pin wide body SOIC package (package code-DFM). SOIC와 SOP(Small Outline Package)는 매우 유사하지만, 둘 사이에는 차이점이 있습니다. 3D Model Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) Apr 26, 2024 · – SOIC (Small Outline Integrated Circuit): SOIC is a specific type of SOP that houses integrated circuits (ICs) in a small, surface-mount package. The part numbers on the packages are sometimes shortened to fit in the reduced area. Apr 26, 2024 · The efficient testing and validation of the high-voltage (HV) insulation of small-outline integrated circuit (SOIC) packages presents numerous challenges when trying to achieve faster and more Innovative Solutions in Semiconductor Packaging. A tiny outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package. True position spread tolerance of each lead is ±0. SOIC packages come in various configurations, typically ranging from 8 to 32 pins. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. It is one of the most commonly used surface mount packages today. The SOIC family provides small surface mount IC packages in standard widths similar to common through-hole DIP packages: SOIC-8 to SOIC-28 – Narrow versions with 0. All dimensions are in millimeters. 05” lead pitch; SOJC – Wider plastic package with lead spacing up to 0. All the packages in the SOIC family are physically different, but they all have the same pin spacing of 1. Integrated Circuits (ICs) part-identification. 5 mm (wide body). Feb 4, 2025 · AMD Ryzen 9 7950X3D TSMC SoIC Package Technology Advanced Packaging Analysis Share This Post The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance. Different Types of IC Packages Dual-in-line Package (DIP) This is the most common through-hole IC package used in circuits The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. 5. SOICs offer space savings, cost reduction, and improved electrical performance due to their compact size and surface-mount nature. Another smaller version of the SOIC is the SSOP. 27mm from the next. SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. The standard form is a flat rectangular body, with leads extending from two sides. 하지만 SOIC Package는 SOJ (Small Outline J-leaded Package) 또한 포함하여 부르는 말입니다. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. 27mm. High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. For example, you might find the SOIC in pagers, cordless phones, fax machines, copiers, printers, computer peripherals A/V products and automotive systems. Whether differences like these are "important" depend on your application. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Jan 12, 2025 · Footprint Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) Nov 4, 2010 · 8-pin soic package, 1. QSOP. The standard form is a flat rectangular or square body, with leads extending from two or all four sides. 125mm at maximum material condition. 6 mm. Evaluating Data Setup and Hold Timing Slack 1. SOIC is available in a variety of 8-Pin packages (MSOP, PDIP, and SOIC) and is ideal for applications requiring small size and low power. 5mm Creepage) Integrated Protection Ensures Robust Communication ±10kV ESD (HBM) on Driver Outputs/Receiver Inputs Failsafe Receiver Prevents Fault Transition on Receiver Input Short or Open Events (MAX22025F– MAX22028F) Withstands 3. Below, you are going to read the most common types of packages in easy language. 어려운 용어 같지만 차근차근 들여다보면 컨셉이 그리 어렵지는 않습니다. 3. SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. 4. dxf)： Land pattern Data in DXF Format; Land Pattern(. 8w次，点赞36次，收藏252次。SO、SOP、SOIC封装详解(关于宽体、中体、窄体)第一篇一、简介SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。 Package Width: 26. Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. SOP（Small Outline Package）封装和SOIC（Small Outline Integrated Circuit）封装之间的差异相对细微，实际上，SOIC 是 SOP 的一种具体类型。以下是它们的细微差别及是否可以混用的分析： 1. Small-outline integrated circuit (SOIC) packages are compact, rectangular, “Dual In-line” ceramic packages engineered to fulfill the escalating need for miniaturization and enhanced component density. 6 mm nominal (maxi-mum of 1. Maximum mold flash, protrusions or gateburrs is 0. com Learn how to handle and assemble Freescale Small Outline Integrated Circuit (SOIC) package during Printed Circuit Board (PCB) assembly. Learn about the SOIC package, a surface-mounted IC with gull wing leads and various pin counts. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. SOIC, SOT-143, and SOT-23 Packages SOIC PACKAGES (narrow and wide body) Notes 1. SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 May 31, 2023 · Size: SOIC packages are generally larger than SOP packages. There are non-exposed (normally just referred to as SOIC-x or SOIC-xN) and exposed pad versions (which are normally indicated with an “E” in the package name 6 ). SOIC packages have a smaller overall height compared to other packages, allowing for more compact circuit designs. The pitch of the WSON varies. 050" lead spacing and typically come in lead counts ranging from 8-24 leads and have a Gullwing lead configuration. xml)：Land pattern Data in JEITA LPB C-format 在事实上，针对soic封装的尺寸标准，不同的厂家分别或同时遵循了两种不同的标准jedec（美国联合电子设备工程委员会）和eiaj（日本电子机械工业协会），结果就导致了“宽体、中体和窄体”三个分支概念的出现，把很多人搞得晕头转向，也激起很多砖家在“宽 Jan 21, 2015 · The WSON (Plastic Small-outline No-lead Package) is a SMD package. 75mm height 在电子行业中，SOP（Small Outline Package）和SOIC（Small Outline Integrated Circuit）是两种常见的集成电路封装形式。尽管它们在外观上可能相似，但在某些细节上存在差异，这些差异可能会影响它们的应用和兼容性。本文将详细探讨SOP封装和SOIC封装的区别。 1. BGA IC Package. Package Configurations (PDF) I was recently looking at some SPI SRAM chips at Mouser and noticed that a particular IC came in both a SOIC-8 and TSSOP-8 package. Lead Spacing: The lead spacing, or pitch, is another distinguishing factor. Dual-package layouts for SOIC SOIC to SON SOIC to SOT Figure 4. SOIC/SOJ Packing in Tubes and Tape and Reel The SOIC and the SOJ are small-outline surface-mounted plastic IC packages. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 27mm pitch, 1. Nov 2, 2023 · There are several variations of SOIC packaging, including Small Outline J-Lead (SOJ), Mini Small Outline Package (MSOP), Shrink Small Outline Package (SSOP), and Thin Small Outline Package (TSOP). The standard SOIC package features include: Body size: Typically 1. Lead pitch: 1. 92-31. 9 mm for the smallest SOIC-4 package to 11. Maximum inter-leadflash or SOIC（Small Outline IC Package）は、IC パッケージングで最適なパフォーマンスが求められるアプリケーションに適したリードフレームベースのパッケージです。 Innovative Solutions in Semiconductor Packaging. It is available in 8 to 28 lead counts. Semiconductor. avjr February 4, 2025, 11:19pm 1. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. 9640 SW Sunshine Ct. Small-outline IC (SOIC) & Small-outline Package (SOP) DIP comes with the version SOIC and SOP wherein the lead spacing is relatively reduced so that it helps in space utilization on PCB. They can have a few different variants: Jan 21, 2015 · The JEDEC version of the SOIC (a. 75 mm). Standard Pb-free lead finish on these packages is Matte Tin Plating. 5kV RMS Isolation Voltage for 60 Seconds (V ISO) The SOIC package is a rectangular "Dual In-line" style ceramic package. 정확한 의미로 구분지으면 SOIC 안에 SOP와 SOJ가 있다고 보는게 맞습니다. Dec 13, 2022 · IC Package Types. 25 (0. However, the cost difference may be offset by the advantages of SOIC packages in terms of performance, size, and ease of assembly. They are on a . QFN Features QFN packages have numerous advantages over conventional lead frame-based packages. Apr 13, 2023 · The wide body SOIC package (sometimes referred to as SOx_W or SOICx_W) is a larger version of the narrow body SOIC package, with differences mainly concentrated on the dimensions of WB and WL. xml)：Land pattern Data in JEITA LPB C-format SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. Each pin on an SOIC package has a space of about 1. 24 mm Pitch: 2. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Feb 28, 2022 · TSMC의 3D 적층 기술, SoIC. [1] As the package matures, QFN volumes in analog and logic are expected to increase significantly, and QFNs are expected to displace QFP, SOIC and SOT style packages in both new devices and legacy designs. SOIC vs SSOP Package. May 30, 2024 · A: SOIC (Small Outline Integrated Circuit) packages are surface-mounted and have a smaller footprint compared to DIP (Dual In-line Package) packages, which are through-hole. 27mm (just like SOIC, for example the Cypress WSON 8L package), the TI DMB package as a pitch of 1. They are available in different pin counts, body sizes, and […] Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 4mm. 27 millimeters. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V Devices 1. This is why it’s essential to make sure you have an SOIC footprint that matches the exact dimensions and tolerances of the manufacturer’s package for the component you are using. QFP -> TQFP, VQFP, LQFP; SOP -> PSOP, TSOP, TSSOP; SOT IC Package; 3. The board area computation is based on a lead-tip to lead-tip distance of 6 mm (nominal) and a body dimension of 5 mm (maximum, excluding mold flash). SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. The VSSOP package does not have as much Apr 13, 2015 · Hand soldering SOIC packages Post by satindas » Mon Apr 13, 2015 2:32 pm I need to get 6 x 74HC595's on a small board and I just started looking at the SOIC (SO-16) option. 54 mm Height: 4. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. The convention for naming the package is SOIC or SO followed by the number of pins. 5mm. What’s VSOP Package? Very Small Outline Package (VSOP) is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. SOP. DIP (Dual In-line Package) DIP is a classic example of an IC package. Quarter Small Outline Package (QSOP) is an SOP with a pin pitch of 25mils(0 Innovative Solutions in Semiconductor Packaging. 8 mm (narrow body) and 300 mils or 7. The package total height is 1. It’s also hard to solder with a soldering iron due to the underside thermal pad. 25 millimeters. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 The Small Outline Integrated Circuit, or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The ISO772x family of devices is available in 16-pin SOIC wide-body (DW), 8-pin SOIC wide-body (DWV), and 8-pin SOIC narrow-body (D) packages. 3. SOIC Packages: Leading Modern Miniaturization. 8 PIN SOIC/SOIN PACKAGE OUTLINENotes:1. Oct 23, 2024 · There are different types of IC packages, such as SOIC packages and dip packages. They are similar to SOIC packages but have a slightly different form factor. 2 mm 2. DMB/PWSON and DOD are common seen WSONs from Texas Instruments. Dec 24, 2024 · The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Additionally, the thinness of the package ensures that it is less prone to damage during handling and assembly than other chip packages. IMG_1162 Jul 3, 2020 · The GrabCAD Library offers millions of free CAD designs, CAD files, and 3D models. COMPLIANT TO JEDEC STANDARDS MS-012-AA 012407-A 0. Their height is similar to SOIC package. You have read previously that every package is built for a particular function. Innovative Solutions in Semiconductor Packaging. The soldering process involves applying solder paste to the pads on the PCB, placing the SOIC package onto the pads, and then reflowing the solder to establish electrical and mechanical connections. Mini Small Outline Package or Micro Small Outline Package (MSOP) is an SOP with a pin pitch of 0. 8 mm for larger SOIC packages with many pins. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. 0mm, and the TI DQD package as a pitch of 0. QFN IC Package. xml)：Land pattern Data in JEITA LPB C-format SoIC InFO_B SoC TSMC-SoICTM + InFO_oS HBM HBM TSMC-SoICTM + CoWoS® SoIC SoIC 3DFabrics updates- additional structures, Packaging Envelop Increase and SoIC Pitch Scaling Advanced Packaging 3D Chip Stacking (SoIC) + Advanced Packaging CoWoS® InFO 3D Chip Stacking (SoIC) + Advanced Packaging Advanced Packaging Integration Technologies SOIC-8 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Typical VSOP lead counts range from 8 to 40. May 31, 2024 · TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. The SOIC has gull wing leads while the SOJ has J-formed leads. Like other surface-mount ICs, SOIC is mounted on the surface of a PCB using SMT (Surface Mount Technology), featuring a smaller footprint and higher pin density. Compact 8-Pin Wide Body SOIC Package (5. Physical and Electrical Differences: Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), SC70, etc. SOIC packages are JEDEC-compliant, and come in a variety of body widths, the most popular of which are 150 mils or 3. In a presentation at the company's recent technology symposium, TSMC outlined a 1. Our Small Outline Integrated Circuits (SOIC) are designed for applications that require reduced size. Specification Comparison 1. 따라서 두 패키지는 비슷한 형태이지만 두께와 높이에서 차이가 있습니다. Typical V SOP lead counts range from 8 to 40. SOIC packages are JEDEC-compliant, and come in a variety of body widths. D (SOIC) and NS (SO) are the package drawing codes, NOT the part suffixes! M is the part suffix for SOIC, NS for SO. Camber not to exceed 1 mm in 100 mm, also not to exceed 1. 75mm to On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOIC8-N package. k. 5. 85 mm. Oct 29, 2024 · Small-Outline IC (SOIC) & Small-Outline Package (SOP) (SOP) Small-outline Package. Oct 27, 2017 · SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. This package is smaller than the other two styles and has Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). 2. Dual-package layouts for TSSOP TSSOP to SON TSSOP to SOT VSSOP package layout The VSSOP package has a smaller form factor than the TSSOP and SOIC packages, making it the smallest second-ary common-package option to use as a second source. The body sizes are typically smaller than a standard package. SMD IC Package. SOIC는 두꺼운 패키지로 주로 사용되며, SOP는 얇은 패키지를 의미합니다. Find guidelines for PCB design, rework, reliability, thermal characteristics, and package dimensions. They have the same package outlines but differ in the types of leads they use. Typical VSOP body widths range from 3 mm to 10 Jul 13, 2015 · When creating a footprint for a SOIC, it’s important to recognize that they can differ based on the package’s body size, pad span, pitch of leads, and so on. SSOP lead counts range from 8 to 64. Title: Package Drawing - SO 24-Lead Plastic (Wide . It varies from various pins, similar to SOIC, but generally with 8 pins (all also have exposed thermal pads). Aug 10, 2001 · SOIC Package 또한 뒤에 Pin 번호를 붙여서 부르기도 합니다. Feb 4, 2025 · Please help identifying this Ic package SOIC-8. 27mm or 0. The overall length also differs based on the number of pins as well. VSOP - Very Small Outline Package The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. Jan 27, 2021 · 文章浏览阅读6. 5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance . Jun 9, 2023 · How are SOIC packages soldered onto a circuit board? SOIC packages are soldered onto a circuit board using surface-mount technology (SMT). SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. 15mm per end. 65mm for narrow versions SOIC Package 또한 뒤에 Pin 번호를 붙여서 부르기도 합니다. 0098) SOIC vs. cbd hoic kxptbi oeyn iafabg tmotf qncxgail xwt eui cnjl upez losup yohrzq spqzg afoovrdr